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Nanofabrication service;
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academic users; industrial users Podcasts
Making the future of Micro and Nanofabrication a reality
Materials Deposition
Technology |
Tools |
|---|---|
| Epitaxy | MBE , MOCVD, MOVPE, UHV-CVD |
| Atomic Layers Deposition (ALD) | Monolayer by monolayer growth machines |
| UHV-CVD | Ultra-High Vacuum CVD |
| Evaporation | Thermal evaporators, Ebeam evaporators |
| Sputtering | DC, RF, Magnetron… plasma machines |
| CVD | LPCVD, PECVD |
| Specialized tools clusters | Sequences of layer depositions without breaking vacuum |
| Electroplating | Wet electroplating, chemical deposition |
| Dip coating | Dip-coating tool |
| Carbon coating | Carbon evaporator |
| Pulsed Laser Deposition | PLD deposition chambers |
| Liquids/pastes direct deposition | Inkjet, serigraphy |
Dry & Wet Etching
Technology |
Tools |
|---|---|
| Wet chemical etching | Wet benches KOH, HF, metal etching, etc. Si, III/V materials, dielectrics, metals |
| Dry Etching tools | Ion beam etching, Reactive Ion Etching, ICP Etching, Cryo. RIE, CAIBE, Plasma cleaners (Silicon, III/V materials, metals, organics) |
| Focused Ion Beam systems | FIB, nanoFIB systems |
| Related tools | Critical point dryers |
Characterization & Testing
Technology |
Tools |
|---|---|
| Electrical testing | Four points probers, RF probers / parameter analyzers, Impedance measurements, Hall characterizations, STM |
| Material characterization | RBS, X-Ray characterization (EDX, XRD, XRF, etc.), Photo-spectrometers, Spectrofluorimeters, Gas chromatographs, Micro-Raman / fluorescence spectroscopy, FTIR, Acoustic characterization |
| Geometry characterization | Optical microscopes, Profilers, Interferometers, AFM, SEMs, Ellipsometers |
| Mechanical stress testing | Stress testers |
Preparation of Samples & Integration
Technology |
Tools |
|---|---|
| Cleaning | Plasma cleaning, Ozone Cleaning, RCA & Piranha cleaning, Megasonic cleaning, Ultrasonic cleaning |
| Milling, polishing, grinding | Grinding, Ion milling, Abrasive Polishing, Chemical Mechanical Polishing, cross-section polishing |
| Chips separation | Dicing precision saws, scribers, wafer expanders, laser cutting |
| Pick & place | Positioning of chips on a board |
| Wafer bonding | Wafer bonding machines (anodic bonding, Si-Si bonding, thermocompression bonding, etc.) |
| Assembly & electrical connections | Ball bonding, Flip-chip bonding, Wire bonding |
| Packaging | 3D printers, vacuum welder |